| 1 |
Min-Jun Guo; Shu-Yu Lin; Yu-Cong Wang; Chia-Lin Hsieh; Sung-Mao Wu; Shang-Chih Chou (2023, May). "Verification of Circuit Signal Detection Method for Non-contact Measurement System" 2023 International Conference on Electronics Packaging (ICEP).
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| 2 |
Wei-Chiao Wang; Hsing-Chuan Peng; Yu-Cong Wang; Chia-Lin Hsieh; Sung-Mao Wu; Ming-Shan Lin; Yuan-Fu (2023, May). "Reserch of Unknown Noise Source in Package Power Distribution System" 2023 International Conference on Electronics Packaging (ICEP).
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| 3 |
Han-Nien Lin, Tzu-Hao Ho, Po-Ning Ko, Yu-Lin Tsai, Huei-Chun Hsiao, Sung-Mao Wu, Jeffrey Yen-Ting Li (2021, Sep). "Switching Noise Analysis for Conducted Electromagnetic Interference from of Power Electronic Module" 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
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| 4 |
Wei-Chiao Wang, Sung-Mao Wu, Yuan-Fu Ku, Ming-Shang Lin, Bo-Ting Liu, Hsien-Hung Lin (2021, Aug). "Research on Noise Distribution of Power Network System" 2021 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
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| 5 |
Tzu-Wen Hung, Hsing-Chuan Peng, Sung-Mao Wu (2021, Aug). "Equivalent Probe Model of Non-contact Measurement for Near-field" 2021 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
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| 6 |
Guan-Yo Lin, Jia-Fang Deng, Pei-Wen Li, Yun-Yu Liu, Sung-Mao Wu (2021, May). "Non-contact Measurement with Electric Field Probe" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 7 |
Cheng-Tao Li, Che-Yu Liu, and Sung-Mao Wu (2020, Aug). "Time domain Near-Field Measurement Technology and Simulation for System Level ESD Testing" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 8 |
Bing-Jia Zhong, Sung-Mao Wu (2020, Aug). "Design SIW iris bandpass filter at 18GHz" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 9 |
Po-Yu Huang, Meng-Ju Wu, and Chih-Hsueh Lai, Sung-Mao Wu (2020, Aug). "Solution Research of Simultaneous Switching Noise Reduction in Power DDistribution Network" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 10 |
Yu-Cong Wang, Chih-Cheng Li, You-Sheng Li, Jia-Lin Hsieh, Sung-Mao Wu (2020, Aug). "Simulating and verifying the electromagnetic interference on the four layer PCB" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 11 |
Wen-Han Chiu and Sung-Mao Wu (2020, Aug). "Substrate Integrated Waveguide Directional Coupler in Ku Band" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 12 |
CHIH-LUN CHIEN, MING-JIE LI, YU-KAI CHEN, JI-HONG WU, SUNG-MAO WU (2020, Aug). "The Application of the Near Field Measurement" 2020 IEEE International Workshop on Electromagnetics (iWEM 2020).
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| 13 |
Hao Wei Chen, Chi Jui Lee, Sung-Mao Wu (2019, Dec). "Three-dimensional stacking miniaturization and high frequency of resonant ring" 2019 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
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| 14 |
Wu Sung-Mao , Wang Wei-Chiao , Guo Min-Jun , Lin Min-Shang , Su Chia-Hung , Chen Bo-You (2019, Jun). "Investigating Simultaneous Switching Noise Distribution in Frequency Domains by Near Field Scan" In 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibil.
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| 15 |
Hong-Yin Hsieh, Jheng-Yuan Ruan, Min-Jun Guo, Wei-Chiao Wang, Sheng-Wei Guan, Sung-Mao Wu (2019, Apr). "Effect Analysis of Application of Energy Band Gap to Electrostatic Discharge Protection" International Conference on Electronics Packaging 2019.
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| 16 |
Yi-Ting Tsou, I-Huai Wang, Sung-Mao Wu (2018, Dec). "Discussion of the Signal Transmission Crosstalk" 20th Electronics Packaging Technology Conference.
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| 17 |
Sung-Mao Wu,Sheng-Wei Guan,Cheng-Dao Li,Li-Xuan Tsai,Chun-Ting Kuo,Chia-Hung Su,Ming-Kun Hsieh (2018, May). "Dielectric Constant and Loss-tangent Extraction using Near-field Technology and Phase Delay Method" 2018 Joint IEEE EMC &APEMC Symposium.
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| 18 |
Sheng-Wei Guan, Chih-Wen Kuo, Sung-Mao Wu, Cheng-Tao Li (2018, Apr). "Coupling Model and Non-contact Measurement Approach by Near-field Technology" International Conference on Electronics Packaging 2018.
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| 19 |
Wei-Chiao Wang, Kuan-I Cheng, Sung-Mao Wu (2017, Dec). "Application of Failure Analysis on Package Copper Pillar Bump Electromigration" 19th Electronics Packaging Technology Conference.
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| 20 |
Chia-Hsuan Tsai, Cheng-Dao Li, Sung-Mao Wu (2017, Dec). "Establish Electrostatic Discharge Simulation Environment Combined with Near-Field measurement" 19th Electronics Packaging Technology Conference.
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| 21 |
Tiang An Wang, Bo You Chen, Sung-Mao Wu (2017, Dec). "The Design of Near-Field Horizontal Probe Design for Wireless Charging Coil" 19th Electronics Packaging Technology Conference.
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| 22 |
Li-Xuan Tsai, Kuan-I Cheng, Sung-Mao Wu (2017, Dec). "Dielectric Constant Measurement using Near-Field System" 19th Electronics Packaging Technology Conference.
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| 23 |
Yu-Ren Chen; Bo-You Chen; Sung-Mao Wu; Ming-Shan Lin; Chia-Hung Su (2017, Dec). "The Extraction Method of Relative Permittivity by Near-Field Measurement" 2017 Asia-Pacific Microwave Conference (APMC 2017).
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| 24 |
Ren-Fang Hsu, Meng-Hua Tu, Sung-Mao Wu, Chun-Sen Wu, Yung-Mao Cheng, Chia-Lin Chen, Wei-Jen Chen, Ch (2017, Jul). "Novel Testing Method for Signal Coupling and Discontinued Noise by Near-Field Measurement System" 12th International Conference on Innovative Computing, Information and Control (ICICIC2017).
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| 25 |
Min Chou, Kai-Wen Liang, Meng-Hua Tu,Sung-Mao Wu (2017, Apr). "Transmission Line Signal Radiation Pattern by Near-Field Measurement" International Conference on Electronics Packaging 2017.
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| 26 |
Kuan-I Cheng, Yi-Cheng Liu, Pai-Chou Liu, and Sung-Mao Wu (2017, Apr). "Electrical Analysis and Solder Joint Quality of PCB Land-pad Design for QFP E-pad package" International Conference on Electronics Packaging 2017.
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| 27 |
Chih-Cheng Chuang,Kuan-I Cheng,Sung-Mao Wu,Lung-Shu Huang,Bang-Cheng Chiu (2016, Dec). "Novel Correctable Testing Interface for High Speed/Frequency Device Testing" 18th Electronics Packaging Technology Conference.
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| 28 |
Wen Chou,Bo-You Chen,Sung-Mao Wu,Cheng-Chang Chen,Ming-Shan Lin (2016, Dec). "Double-side direct contact calibration thru kit with non-exchanging structure" 18th Electronics Packaging Technology Conference.
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| 29 |
Che-Shuan Lin, Bo-You Chen and Sung-Mao Wu (2016, Dec). "Modeling The Package IP Physical Model and Verification" 18th Electronics Packaging Technology Conference.
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| 30 |
Po-Chou Pan, Shao-Nan Hong, Sung-Mao Wu (2016, May). "Optoelectronic E-field probes with amplifier for interference free near field antenna measurements" The 7th Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016).
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| 31 |
Shao-Nan Hong,Sung-Mao Wu,Cheng-Chia Lin,Jian-Ming Wu (2016, May). "The Time-Domain E-field Probe Using RF-Over-Fiber and Power-Over-Fiber Technology" he 7th Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016).
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| 32 |
Pai-Chou Liu and Sung-Mao Wu (2016, Apr). "Study of QFP E-pad Package VS.PCB Land Pattern Design Soldering and Reliability" International Conference on Electronics Packaging 2016.
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| 33 |
Pei-Chen Kuo, Yu-Yung Wu, Sung-Mao Wu (2016, Apr). "System Power Integrity and Radiation Analysis of Packaging by CMOS Inverter" International Conference on Electronics Packaging 2016.
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| 34 |
Li-Wen Lai, Jia-Yu Liu, Yu-Yung Wu, Sung-Mao Wu and Ming-Chang Fu (2015, Dec). "Near-field to Far-field Transformation with Non-contacting Near-field Measurement by Using Kirchhoff Surface Integral Representation" Asia-Pacific Microwave Conference(APMC2015).
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| 35 |
Yu-Jen Peng, Ying-Jyun Chen, Meng-Hua Tu, Sung-Mao Wu, and Cheng-Chang Chen (2015, Dec). "A Real-Time Simultaneous Switching Noise Analysis by Near-Field Measurement System for BGA Package" 2015 Asia-Pacific Microwave Conference(APMC2015).
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| 36 |
Ming-Yang Huang, Sung-Mao Wu and Shao-Nan Hong (2015, Dec). "Development of Near Field Detecting Probe By Optoelectronic Elements" 2015 Asia-Pacific Microwave Conference(APMC2015).
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| 37 |
Hua-Jian Hsu Sung-Mao Wu, Meng-Hua Tu and Cheng-Chang Chen (2015, Dec). "Study of Double-side Thru Calibration Kit by Non-contact Coupling Structure" 2015 Asia-Pacific Microwave Conference(APMC2015).
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| 38 |
Lai-Ji Wang, Meng-Hua Tu and Sung-Mao Wu (2015, Dec). "Effect and Verification of Substrate Trace Design by PKG Design Modeling" 2015 Asia-Pacific Microwave Conference(APMC2015).
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| 39 |
Hsiang-Yi Cheng, Shao- Nan Hong and Sung-Mao Wu (2015, Dec). "Development of innovated optoelectronic E-field probes for Near Field Scanning" 2015 Asia-Pacific Microwave Conference(APMC2015).
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| 40 |
Chi-Yang Li, Kuan-I Cheng, Sung-Mao Wu, Tung-Bao Lu and Yi-Chang Lee (2015, Dec). "Reliability Analysis Experiment of Electro Migration and Maximum Current Test" 2015 Asia-Pacific Microwave Conference (APMC2015).
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| 41 |
Han-Hsiang Shih, Meng-Hua Tu and Sung-Mao Wu (2015, Dec). "Non-exchanging Structure Calibration Kit For Double-side Direct Contact Measurement" 2015 Asia-Pacific Microwave Conference (APMC2015).
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| 42 |
Chia-Jui Tsao, Meng-Hua Tu, Sung-Mao Wu and and Cheng-Chang Chen (2015, Dec). "Non-contacting signal transmission measurement and modeling by coupling theory" 015 Asia-Pacific Microwave Conference(APMC2015).
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| 43 |
Chung-Hsin Li, Meng-Hua Tu, Sung-Mao Wu and Cheng-Chang Chen (2015, Dec). "Novel Radiation Signal Detecting and Non-Contacting Probe Modeling by Biot-Savart Theorem" 015 Asia-Pacific Microwave Conference(APMC2015).
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| 44 |
Cheng-Dao Li, Sin-Jay Lin, Yu-Yung Wu and Sung-Mao Wu (2015, Dec). "IR-drop and Signal-integrity Measurement of BGA by A Broadband push-push VCO" 2015 Asia-Pacific Microwave Conference (APMC2015).
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| 45 |
Kuan-Yi Cheng,Sung-Mao Wu,Lung-Shu Huang,Chen-Jang Cheng,Yen-Tang Chen (2015, Apr). "Novel Impedance Controllable Testing Socket for High Speed/Frequency Package" 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
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| 46 |
Bo You Chen,Sung Mao Wu,Ming Shan Lin and Tzu Wen Kaung (2015, Apr). "Embedded Band-pass Filter Design in Packaging Substrate" 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
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| 47 |
Yin-Hsiu Yeh, Hsin-Fang Li, Sung-Mao Wu Ren-Fang Hsu, and Cheng-Chang Chen (2014, Dec). "Novel Non-Contact Measurement Technology by Radiation Model Extraction of Broadband Circuit and Signal Reconstruction" 2014 Asia-Pacific Microwave Conference (APMC).
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| 48 |
Sung-Mao Wu, Hsin-Fang Li, Yin-Hsiu Yeh,, Ren-Fang Hsu ,Cheng-Fu Yang (2014, Dec). " Novel Non-Direct Signal Detect Probing and Modeling developed by Biot-Savart Theorem" 2014 The Third International Conference on Innovation Communication and Engineering (ICICE).
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| 49 |
吳松茂、許仁芳、陳誠章 (2014, Jun). "系統構裝電磁干擾抑制最佳化" 2014全國電磁相容技術與實務研討會.
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| 50 |
Shi-Yao Chu, Yu-Ru Lo, Yu-Yung Wu, Wei-Chi Chen, Sung-Mao Wu (2014, May). "Transformer Based Broadband and High Tuning Sensitivity VCO Detector and RF Source for On-Package PI and SI Verification" 2014 International Congress on Natural Sciences and Engineering (ICNSE).
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| 51 |
Meng-Hua Du, Bei-Wen Li, Lung-Shu Huang, and Sung-Mao Wu (2014, May). "Novel Non-exchange Layer Structure Thru Kit of Double-sided Probing Calibration for SiP Measuremen" 2014 International Congress on Natural Sciences and Engineering(ICNSE).
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| 52 |
Wei-Chi chen, Yu-yung Wu, Yuan-ming Wu and Sung-Mao Wu (2013, Apr). "A CMOS Inverter Detector for Package High-speed Characteristics Testing" International Conference on Electronics Packaging.
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| 53 |
Guan-Min Wang, Yu-Chi Kuo, Wen-Te Chien and Sung-Mao Wu (2013, Apr). "Using Electromagnetic Band-gap Structure to eliminate frequency multiplication Noise and Implement 3D Band-pass filter on Testing Load Board" International Conference on Electronics Packaging.
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| 54 |
Wen Yi Ruan, Ting-Han Chien, Lung-Shu Huang and Sung-Mao Wu (2013, Apr). "Using for Three-Dimensional Broadband Double-side Direct Thru Kit with Non-exchange Layer Design and analysis" International Conference on Electronics Packaging.
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| 55 |
Ting-Han Jan, Lung-Shu Huang, Sung-Mao Wu (2012, Dec). "Novel Double-side Direct Thru Kit Design and Measurement with Non-exchange Layer Structure" Asia Pacific Microwave Conference.
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| 56 |
Guan-Min Wang, Yu-Yung Wu, NG Sin-Shyh, Lung-Shu Huang, Sung-Mao Wu (2012, Dec). "A Broadband and High Tuning Sensitivity VCO Detector for On-package IR-drop and Signal-integrity Measurement" Asia Pacific Microwave Conference.
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| 57 |
Wen-Te Chien, Reng-Fang Hsu, Wei-Chi Chen, and Sung-Mao Wu (2012, Dec). "A Novel Signal Transformation Measurement and Modeling by Non-contacting Coupling Technology" Asia Pacific Microwave Conference.
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| 58 |
Yi-Ching Wu, Yu-Chi Kuo, Po-Hui Yu and Sung-Mao Wu (2012, Dec). "3D Structure Band-pass Filter Implementation by Vias and Power/Ground Plane Effect on Testing Load Board" Asia Pacific Microwave Conference.
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| 59 |
Yuan-Ming Wu, Ren-Fang Hsu, Sung-Mao Wu (2012, Apr). "Analysis Approaching of Transformer-base Differential Inductor" International Conference on Electronics Packaging.
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| 60 |
Yi-Ching Wu, Ping-Sheng Wu, Lung-Shu Huang, Sung-Mao Wu, Cheng-Fu Yang (2012, Apr). "A High Linear Gilbert-cell Mixer Design by Integrated Transformer-base Balun" International Conference on Electronics Packaging.
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| 61 |
Chi-Lin Li, Ng Sin Shyh, Sung-Mao Wu, Po-Hui Yu, Yuan-Ming Wu (2012, Apr). "Via Design Intellectual Property and SSN Inhibition Solution in Packaging Substrate" International Conference on Electronics Packaging.
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| 62 |
Chun-Ting Kuo, Ching-I Chien, Yu-Li Shen, Pei-Yu Lyu, Sung-Mao Wu (2011, Dec). "Miniaturized Full Differential Bandpass Filter Design Embedded in Organic Substrate" Asia-Pacific Microwave Conference 2011 (APMC 2011).
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| 63 |
Sung-Mao Wu*, Ming-Huei Huang, Che-Hao Li, Chun Ting Kuo, Po-Hui Yu (2011, Dec). "A Novel Miniaturized Coupled Bandpass Filter Realized in Laminate Substrate" Asia-Pacific Microwave Conference 2011 (APMC 2011).
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| 64 |
Sung-Mao Wu*, Reng-Fang Hsu, Cheng-Han Hwang, ,Yung-Chi Tang, Cheng-Chang Chen (2011, Dec). "Radiation Modeling and Performance Reconstructing of Signal Connection in Package Substrate using Non-contacting Probe" Asia-Pacific Microwave Conference 2011 (APMC 2011).
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| 65 |
Jiun-you Lu, Wei-Chi Chen, Sung-Mao Wu*, Kao-Yi Wang, Ming-Shan Lin, Yen-Tang Chang (2011, Dec). "Electro-Magnetic Interference Reducing Solutions for Package Stacking Applications" Asia-Pacific Microwave Conference 2011 (APMC 2011).
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| 66 |
Che-Hao Li, Chi-Lun Yeh, Ming Huei Huang, Sung-Mao Wu (2011, Dec). "Harmonic Suppression Bandpass Filter Designed by E-type SIR with Shunt Open Stub" Asia-Pacific Microwave Conference 2011 (APMC 2011).
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| 67 |
Sung-Mao Wu*, Tai-Chiuan Wang, Chiao-Han Lan (2010, Oct). "Detecting Defects on Planar Circuits by Using Non-contacting Magnetic Probe" Asia-Pacific Microwave Conference (APMC).
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| 68 |
Sung-Mao Wu*, ing-Yao Wu, Bo-Huie Yu, Cheng-Fu Yang, Chen-Chao Wang (2010, Oct). "Co-Design and Modeling of Novel Packaging Interposer with IPD Layers" Asia-Pacific Microwave Conference (APMC).
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| 69 |
Sung-Mao Wu*, Yen-Hsun Chen, Sheng-Wei Guan, Chun-Ting Kuo Bo-Huie Yu, Cheng-Fu Yang (2010, Oct). "Modify-T Long Microstrip Line Compose by Integrated Passive Components" Asia-Pacific Microwave Conference (APMC).
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| 70 |
Sung-Mao Wu*, Yen-Ting Lu, Ming-Hui Huang, Kao-Yi Wang (2010, Oct). "Using Multilayer S-Type Coupled Resonators to Realize the 2.4G Bandpass Filters" Asia-Pacific Microwave Conference (APMC).
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| 71 |
Sung-Mao Wu*, Ting-Yao Wu, Bo-Huie Yu, Chen-Chao Wang (2010, Sep). "Modeling and Co-Design of Novel Packaging Interposer with IPD Layers" International Conference on Solid State Devices and Materials.
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| 72 |
Tien-Tsorng Shih*, Pei-Hao Tseng, Hao-Wei Chen, Sung-Mao Wu, Wood-Hi Cheng (2010, Aug). "A 25-GHz TO-Can Header for Coaxial Laser Package on Transmission Applications" PSISDG.
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| 73 |
Chin-Ting KUO, Sung-Mao WU* (2009, Dec). "Study of Electromagnetic Interference Analysis and Solution for PoP Packaging" IEEE Electronics Packaging Technology Conference.
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| 74 |
Yung-Hsiang CHUANG, Sung-Mao WU* (2009, Dec). "Effect of Electromagnetic Band-gap Depredation by Plating Through Hold in Packaging Application" IEEE Electronics Packaging Technology Conference.
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| 75 |
Sung-Mao Wu*, Fung-Cheng Zhang, Kuan-Wen Cheng (2009, Dec). "EMI Reducing Solution by Modify EBG Structure for Stacked Packaging" IEEE Electronics Packaging Technology Conference.
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| 76 |
Sung-Mao Wu*, Wang-Yu Lin, Sheng-Wei Guan, Yen-Hsun Chen (2009, Sep). "Symmetrical Planar IPD Balun for WLAN and Wimax Application" International Conference on Solid State Devices and Materials.
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| 77 |
Sung-Mao Wu; Yu-Che Tai; Chi-Chang Lai; Wang-Yu Lin; Shang-Wei Guan (2008, Dec). "Physical Model Extracting of Spiral Inductor on Glass Substrate" EPTC.
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| 78 |
Sung-Mao Wu;Chi-Chang Lai;Hung-Hsiang Cheng;Yu-Che Tai;Chen-Chao Wang (2008, Jun). "Frequency Dielectric Constant and Loss Tangent Extracting of Organic Material Using Multi-length Microstrip" ICEPT.
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| 79 |
Shiuan-Ming Su;Sung-Mao Wu;Chi-Chang Lai;Yu-Che Tai;Wang-Yu Lin;Sheng-Wei Guan (2008, Apr). "Analysis and Modeling of IPDfor Spiral Inductor on Glass Substrate" ICMMT.
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| 80 |
Sung-Mao Wu;Endruw Jahja;Wen-Kuan Yen;Jui-Wen Wang (2007, Dec). "Study of Discrete Capacitor Embedded Process and Characterization Analysis in Organic-Base Substrate" EPTC.
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| 81 |
Sung-Mao Wu;Endruw Jahja;Wen-Kuan Yen;Jui-Wen Wang (2007, Sep). "Embedded Process and Characterization Analysis of Discrete Capacitor in Organic-Base Substrate" SSDM.
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| 82 |
Chia-Wei Hsu, Sung-Mao Wu*, Wen-Kuan Yeh, and Mark Li (2007, Jun). "Efficient Modeling of Packaging for Silicon-Base Inductor and MIM Capacitor" 2007 International Symposium on Signals, Systems and Electronics.
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| 83 |
Chia-Wei Hsu, Sung-Mao Wu*, Wen-Kuan Yeh, and Mark Li (2006, Dec). "Efficient Extracting of Packaging Silicon-Base Inductor" iEDMS 2006.
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| 84 |
Chia-Hsing Chou, Pao-Nan Li, Sung-Mao Wu (2005, Dec). "The More Accurate Method to Extract Dielectric Constant and Loss Tangent of Insulated Material on Microwave Frequencies" EPTC.
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| 85 |
Chien-Chung Wang, Sung-Mao Wu, Chia-Hsing Chou, Chih-Wei Tsai, Ting-Kuang Wang (2005, Jun). " A Novel Embedded Power Plane with 10GHz stopband for SSN" ECTC.
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| 86 |
Sin-Ting Chen, Chih-Wei Tsai, Sung-Mao Wu, Chih-Pin Hung and Tzong-Lin Wu (2003, Oct). "Coupling Effect of Ground Bounce Noise for Ball Grid Array (BGA) package mounted on Printed Circuit Boards (PCB)" Taiwan EMC Conference.
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| 87 |
T.S. Horng; S.M. Wu; H.H. Huang; C.T. Chiu; C.P. Hung (2001, May). "Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs" 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium (IEEE Cat. No.01CH37173).
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